High Thermal Conductivity Alumina Ceramic Sheets - 200pcs Insulating Cooling Pads for Electronic Components Heat Sink(22x28x0.6mm Without-Holes)

200Pcs of aluminum oxide ceramic heat sinks, 96% aluminum oxide, with or without holes, compatible with conventional electronic component models such as TO-220, TO-247, TO-264, and TO-3P to meet heat dissipation requirements.Density: 3.6 g/cm³, thermal conductivity: 29.3 W/m·K, high heat dissipation, effectively transfers heat, insulation up to 22.5 kV, temperature resistance up to 1600°C, thermal expansion coefficient: 0.000003, dimensionally stable under temperature changes, and resistant to damage from thermal expansion and contraction.Lightweight, high strength, does not retain heat, polycrystalline structure, multi-directional heat dissipation, fast heat dissipation speed, superior to most heat-conducting insulating materials, can efficiently dissipate heat from electronic components.

• 200pcs of alumina ceramic sheets made from 96% aluminum oxide, devised for optimal heat dissipation in electronic applications.
• Exceptional thermal conductivity of 29.3 W/m·K and insulation capability up to 22.5 kV, ensuring efficient heat transfer and in high-temperature environments.
• Temperature resistance up to 1600°C with a thermal expansion coefficient of 0.000003, providing dimensional stability under varying temperature conditions.
• Lightweight yet strong polycrystalline structure allows for multi-directional heat dissipation, outperforming most conventional insulating materials.
• Compatible with standard electronic component models such as TO-220, TO-247, TO-264, and TO-3P, making it a versatile choice for various scientific research and experimental applications.