EQCOTWEA Conductive Glass Cutter,19.7"×18.5" ITO/FTO/AZO Quartz Silicon Wafer Cutting Table with Dual Heads,0.02" Accuracy

Cutting Accuracy:0.5mm (0.02") Cutting Thickness:0.016”–0.08” (0.4–2mm) and 0.08”–0.20” (2–5mm) (dual cutter heads) Compatible Materials:ITO/FTO/AZO conductive glass,glass substrates,quartz glass,silicon glass Worktable Size:19.7” × 18.5” (500mm × 470mm) Cutting Area:19.7” × 15.7” (500mm × 400mm) Weight:18.7 lbs (8.5 kg)

• [Precision Cutting]:Achieves clean and accurate cuts for ultra-thin materials down to 0.20″ x 0.20″ (5 x 5 mm),delivering flat,precise edges.Ideal for conductive glass,silicon wafers,and delicate substrates
• [Customized Cutter Wheel]:Our specially designed blade delivers neat edges,faster cutting speed,and minimized material waste for efficient,high-quality output
• [Durable & Maintenance-Free]:Featuring a large 18.5″ × 19.7″ (470 × 500 mm) worktable made of bend-resistant aluminum alloy,along with smooth graphite bearings for long-term stable operation,without maintenance required
• [Flexible & Versatile]:The detachable worktable,positioning guide,and cutting head allow for flexible adjustment to meet a wide range of project sizing needs
• [Widely Use]:Cuts ITO/FTO/AZO glass,quartz,silicon wafers,and slides,supporting thicknesses from 0.016″ to 0.20″ (0.4 – 5 mm) and includes 2 interchangeable cutting heads