BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H

Item Type: For BGA Reballing StationProduct Model: HT-80HMaterial: Aluminum alloyUses: For BGA manual welding for cell phone, chip, laptop CPU, cell phone digital products plant tin rework.Features: For BGA universal reballing station with all aluminum alloy electroplating, not easy to oxidize, and more wear-.Application: Suitable for all for BGA chip ball planting, regardless of rectangular or square chip.Suitable for BGA chip reballing of approx. 9 x 9mm / 0.4 x 0.4in to approx. 43 x 43mm / 1.7 x 1.7in chips.Package List：1 x For BGA Reballing Station(5pcs removable accessories)1 x Hex Wrench

• [PREMIUM ALUMINUM CONSTRUCTION] Built with high-grade aluminum alloy, our BGA reballing station offers superior durability while remaining lightweight. The electroplated finish prevents oxidation and ensures years of reliable performance even with frequent use.
• [UNIVERSAL CHIP COMPATIBILITY] for repairing various electronics including smartphones, tablets, laptops and gaming consoles. Handles both rectangular and square BGA chips from 9mm to 43mm with precision and ease.
• [PRECISION STEEL MESH DESIGN] Features a high-quality steel mesh stencil that ensures solder ball alignment during reballing. The fixed mesh provides stability and accuracy for professional-grade results every time.
• [COMPREHENSIVE REPAIR KIT] Includes 5 essential removable accessories plus a hex wrench for complete BGA rework capability. Everything you need for efficient chip-level repairs in one professional package.
• [ERGONOMIC WORKSTATION] Designed for comfortable, prolonged use with intuitive operation. The sturdy yet lightweight construction makes it ideal for repair shops, technicians, and electronics enthusiasts alike.